SKU : Hybond 522A Thermosonic Ball Bonder
Categories : SEMICONDUCTOR EQUIPMENT ,  Hybond , 
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The 522A incorporates Hybond's exclusive Soft Touch™ force ramping system that bonds effectively even to sensitive materials.The 522A incorporates Hybond's exclusive Soft Touch™ force ramping system that bonds effectively even to sensitive materials.
Superior wire control is provided by a motorized feed system which features front panel operator adjustment of tail length.
Model 522A sets the industry standard for ease of operation and maintenance. Front panel operator controls include force, ultrasonic time, ultrasonic energy, tail length, EFO power, and stage heat.
The 4:1 X-Y manipulator stage movement and Z axis bond motion are conveniently located to reduce operator fatigue.
Precision machined mechanical components with sealed ball bearings at major points are durable and trouble-free. Modular electronics facilitate quick and cost-effective maintenance.
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