Features
- Ring frame cassette : 2 ports
- Wafer capability : 6 inch & 8 inch
- Application wafer : Glass Wafer/Silicon Wafer
- Application tape : Normal or UV tape
- Ring frame capability : 8 inch
- Wafer thickness : 100 um~
- Wafer warpage : 4 mm~
- ESD : 1000V~100V, 10secs, Ion balance : +/-50V
- Operation : 15” touch monitor, Data & GUI by PC
- Main system control : PLC (Omron)
- EMO switch : 4ea
- Noise level : Max. 80dB
- UPH : 50 frame/hr
- Grip ring buffer : Up to 40 ea
- Label size : 10㎜ x 50㎜
- Label attach position : 0°, 90°, 180° and 270°
- Label attach position accuracy : ±1.0㎜
- Tape remained length after cutting : 0.5 mm ~ 1 mm
Optional items:1. Handy scanner
2. SECS Gem communication
3. Ultra-hepa filter
4. Wafer ID reader
Other Information
- Minimum Order Quantity: 1 piece