Digital Ultrasonic Peg Bonder
Attribute:
SKU : Hybond 616B-003
Categories : SEMICONDUCTOR EQUIPMENT , Hybond ,
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Model 616B-003 Digital Ultrasonic Single Channel Peg Bonder is designed for ultrasonic bonding of interconnects in applications that do not require the bonder to feed wire.
Applications include "tacking" tuning ribbons, insulated wire bonding, flex on flex bonding, pin tab bonding, mesh bonding , and ball coining.
When fitted with a WP-280 and OP-75, the 616B-003 becomes a semiautomatic machine for medium to high volume production.
Other Information
- Minimum Order Quantity: 1 piece
