The model Quadrio 1 is a compact plasma cleaning system suitable for in line operation.
Features
- Oxide removal on copper leadframes prior to wire bonding
- Organic decontamination prior to wire bonding
- Adhesion promoter prior to moulding
- Adhesion promoter of die attach materials on leadframes or PBGA strips
- Flux removal from semiconductor packages or hybrids
- Adhesion promoter for Flip Chip packages prior to Underfill
- General activation, cleaning and decontamination
Specifications
- This system can process one leadframe per cycle
- UPH: 120
- Dimensions: 500 x 1350 x 1800h mm
- Weight: 400 Kg
- Power: Single Phase 100-240 V 50 /60Hz, 2.5 KVA
- Air: Dry 3—6 bar
- RF: 300 Watts @13.56 Mhz + Auto Tuner
- Exhaust port: NW25 • 1 gas line standard + 1 optional
- Maxi leadframe dimensions: 280 x 80 x 1 h mm
- Mini leadframe dimensions: 130x25x0.1 h mm
- CE Certified
- Safety covers and interlocks
Other Information
- Minimum Order Quantity: 1 piece