Semi-auto Wafer Mounter | FM-664
Attribute:
SKU : Technovision FM-664 Series
Categories : SEMICONDUCTOR EQUIPMENT , Technovision ,
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This model was developed for both pre-cut and normal tape.
The industry's first universal wafer mounter, it not only serves as a dedicated wafer mounter for pre-cut or normal tape, but can also be adapted to the following uses.
Mode FM-6643 : 300mm(12 inch) semi-automatic wafer mounter
Mode FM-6648 : 200mm( 8 inch) semi-automatic wafer mounter
Uses
- For dicing process with both pre-cut and normal tape
- For dicing process with pre-cut tape only
- For dicing process with normal tape only
- For precut two-layered tape (DAF with dicing tape)
- For normal two-layered tape (DAF with dicing tape)
- For single DAF tape
- For back grind (BG) film
- For front-protection film
- For rear-protection film
- For functional film (resist film, CSP film sealings, underfill film, and others)
Features
- User-settable parameters, including lamination pressure, speed, and temperature
- Variable lamination pitch for normal tape
- Tension-free lamination
- Bubble-free lamination
- Can be customized for non-contact surface lamination
- Equipped with measures against static electricity
- Compact, light-weight, and small-footprint type
Other Information
- Minimum Order Quantity: 1 piece
